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半导体工艺整合工程师岗位职责

2024-07-24 阅读 3443

岗位职责:1.射频半导体工艺持续改进:性能提升、良率提升;2.半导体工艺相关的失效分析及解决方案验证。任职要求:1.深厚的半导体材料、器件、工艺背景知识。2.有CMOSSOI工艺或GaAsInPGaN工艺的开发工作经验,熟悉半导体生产各道工艺的流程和运作机理。3.深刻理解FETHBTpHEMT等器件的工作机理,具有失效分析、器件性能改进和良率提升的能力。4.了解半导体工厂的运行流程,具有较强的向外沟通和组织能力。

篇2:底盘整合工程师岗位职责

底盘集成工程师法国赛科技术工程集团中国总公司赛科工业科技开发(武汉)有限公司,法国赛科技术工程集团中国总公司,赛科工业,赛科Responsibilities:

?Chassiscomponents:

1)Collectthedata:architectureofchassis,componentsfiles(specification,drawings,testreports…)

2)Exchangewithpartner/partner’scomponentssuppliersinordertounderstandthedesignreferential,

3)SharethedatawithexpertsinChina&incentraloffice

4)ManagethedataandstoreitunderITsystem(tobedefined).

?FollowKP1developmentofchassisforinordertoprepareindustrializationoutsideChina:betheinterfacebetweenofficesandthepartnerforalltechnicallyrelatedtopics(intherespectofthejob-sharebetweenPandpartner).

?BusinesstripinSH,Dingzhou(Hebei),Chongqing

?Deliverablesregardingthelocalizationofchassiscomponents:

1)Architectureofchassissub-systems(chassisframe,brake,suspension,steering,axles,wheels,driveshafts):

2)Designmethodology/missionprofile/acceptancecriteria

3)Calculationreport

4)Validations:

a)Subcontractor(ifany)

b)Testprocedure

c)Testreports

5)BillOfMaterial

6)Foreachcomponent:

a)Drawings/Specifications(functionnalorbuilt-toprint)includingEssentialFunctionalCharacteristics

b)Supplier

c)Testprocedureandvalidationcriteria

d)Testreportsonbench(DV/PV)

e)Assemblyprocess/invariants

?DeliverablesregardingSafetyofESC(ISO26262),HPS,Brakecalipersandscrewingassemblies.

Inassistancetosafetynetworkexpert,collectandsupportDFMEA,DV/PV,Safetyrequirement,etc…

Requirement:

?Bachelororabove

?3-5years’workexperience

?FluentEnglish

?Goodmasterofthemechanicaldesign

?CurrentuseoftheChinese+English(speaking/writing/understanding)

?Knowledgeofthetechnicalofchassis:function,architecture+components(brake,suspension,steering,axles,wheels,driveshafts)

?Knowledgeofprojectdevelopmentforchassis

?Experienceintheenvironment.